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Micron expands HBM memory capacity globally to boost market share


Driven by the global AI technology boom, Micron Technology is actively expanding its global production capacity of HBM memory. According to Nikkei Asia, Micron plans to rapidly increase its market share 

in the HBM segment to about 20% in 2025 to match its share of overall DRAM industry revenue.


Micron is expanding its HBM-related R&D and production facilities at its headquarters in Boise, Idaho, U.S. This includes technology validation production lines and volume production lines, the sources said. 

In addition, Micron is also considering building HBM production capacity in Malaysia for the first time, with capacity construction expected to focus on the back-end process portion.


AI computing chip giant NVIDIA is the largest buyer of HBM memory and is expected to purchase about 48% of global HBM capacity, according to Morgan Stanley. Micron has already announced in February 

this year that its 8Hi 24GB HBM3E memory has entered mass production and is supplying NVIDIA's H200 chips. Micron claims that the memory's power consumption is 30% lower relative to the competition, which will help reduce data center operating costs.


This strategic move by Micron shows its ambition in the global semiconductor market and its positive response to the rapid development of AI technology. With the expansion of HBM memory capacity, Micron 

is expected to occupy a more significant position in the global semiconductor market and provide stronger support for the AI and high-performance computing sectors.



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