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Samsung will launch 3D HBM chip packaging services this year


Samsung Electronics will launch three-dimensional (3D) packaging services for high bandwidth memory (HBM) within the year, according to Samsung's internal and industry sources, and the technology is 

expected to be used for HBM4, which will be launched in 2025, according to Korean media reports.


Samsung recently unveiled its latest roadmap for chip packaging technology and services. This is the first time Samsung has released 3D packaging technology for HBM chips at a public event. Currently, HBM 

chips are mainly packaged in 2.5D technology. 


Samsung's latest packaging technology stacks HBM chips vertically on top of the GPU to further accelerate data learning and inference processing, and the technology is seen as a game-changer in the 

fast-growing AI chip market.


Currently, HBM chips are connected horizontally to the GPU on top of a silicon intermediary layer in a 2.5D packaging technology. In contrast, 3D packaging does not require a silicon intermediary layer or a thin 

substrate that sits between the chips to allow them to communicate and work together.3D packaging reduces power consumption and processing latency, and improves the quality of the semiconductor chip's 

electrical signals.


Samsung calls its new packaging technology SAINT-D, which stands for Samsung Advanced Interconnect Technology-D.


Samsung will offer turnkey 3D HBM packages. Samsung's advanced packaging team will vertically interconnect HBM chips produced by its storage business unit with GPUs assembled by its foundry division for 

fabless companies.


In 2027, Samsung plans to introduce an integrated heterogeneous integration technology that combines optical components that can dramatically increase semiconductor data transfer speeds into a unified AI 

gas pedal package.


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